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Laser Sawing / Multi Sawing Machine

 

Royal Group, being a technology expert, has introduced next-generation robots for diamond processing that provide a cutting-edge framework, resulting in accurate bending and pie-sawing of rough diamonds. This smart solution performs operations while maintaining the best balance of quantity and quality, ensuring maximum productivity.

During processing, the diamond remains fully protected by the latest 3D laser protection system and a power frequency control interface integrated with advanced software.

Features
  • Minimum need for alignment
  • Dust-protective hermetic shield resonator box
  • Strong frame – assurance of minimum vibration
  • Multi-sawing and pie-sawing in single sticking with bending
  • Minimum weight loss and lowest breakage
  • User-friendly software
Specification
  • Dimension : 130 cm * 65 cm * 150 cm (l*w*h)
  • Weight : 525 Kg
  • Axis Travel : 130mm(x), 130mm(y), 75mm(z)
  • Laser Profile : ND : YAG@1064mm TEMoo-Diode pumped solid state
  • Operating voltage : single phase, 230V AC, 16 amp, 50/60 HZ
  • Output Power : >24 watts @10khz
  • Operating Temperature : 20oc to 25oc