+852 34602603

Laser Sawing / Multi Sawing Machine

 

Royal Group being the technology expert introduced new generation robots for diamond processing which gives cutting-edge framework resulting in accurate bending and pie sawing of the diamond rough. The smart solution accomplishes operations by maintaining the best quantity and quality, to ensure the highest productivity. While processing in this system, the diamond is in total protection with the latest 3D laser protection system and power frequency control interface with the software.

Features
  • Minimum Need of Alignment
  • Dust Protective Hermetic Shield Resonator Box
  • Strong Frame:- Assurance of minimum vibration
  • Multi Sawing And Pie Sawing In Single Sticking With Bending
  • Minimum Weight Loss And Lowest Breaking
  • User – friendly Software
Specification
  • Dimension : 130 cm * 65 cm * 150 cm (l*w*h)
  • Weight : 525 Kg
  • Axis Travel : 130mm(x), 130mm(y), 75mm(z)
  • Laser Profile : ND : YAG@1064mm TEMoo-Diode pumped solid state
  • Operating voltage : single phase, 230V AC, 16 amp, 50/60 HZ
  • Output Power : >24 watts @10khz
  • Operating Temperature : 20oc to 25oc